Enhanced Heat Sink Performance Utilizing Capillary-Driven Evaporation.Mueller, Stuart.
Abstract: Heat sinks with the same form factor, but lower thermal resistance than currently available are desirable in many applications. For example, they would benefit the electronics packaging industry by accommodating increased heat dissipation in reduced form factors. An enhanced longitudinally-finned heat sink that exploits evaporative cooling to significantly reduce its thermal resistance w... read more
- Tufts University. Department of Mechanical Engineering.
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