Low Profile Packaging for MEMS Aero-Acoustic Sensors.

Burns, John.

Abstract: This thesis explores both a semi-automated conductive ink process and modifications to Draper Laboratory's i-UHD (Integrated - Ultra High Density) process for packaging MEMS devices. These methods are applied to packaging MEMS acoustic sensors for wind tunnel testing. The primary advantage of these methods is a reduction in surface topology between the package and the integrated MEMS sen... read more

Tufts University. Department of Mechanical Engineering.
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ID: tufts:21092
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