A Thermal Demonstration of High Density Processor Packages.

Lewis, Peter H.

Abstract: As technology continues to miniaturize processor chips, the thermal load of the electronics has become a primary hindrance in the development and implementation of more powerful chips. An internal effort by Draper Laboratory has been made in order to characterize the effect of their high density packaging method on the thermal load. The following thesis provides a thermal characterizatio... read more

This object is in collection:
Undergraduate Honors Theses
Microelectronics--Materials--Thermal properties.
Tufts University. Department of Mechanical Engineering.
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ID: tufts:sd.0000049
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